TMI’s cleanroom is a Class 100 (ISO 5), 3,000-square-foot facility located on the fourth floor of the Faulkner Nanotechnology Building. The facility provides ample space for materials research across a broad range of material classes and is primarily dedicated to lithography, etching, and materials growth, with comprehensive capabilities for materials metrology. The lithography suite includes two UV photolithography systems, a maskless lithography system, and an electron-beam lithography system, providing capabilities ranging from conventional microfabrication to high-resolution nanoscale patterning. The cleanroom offers a wide range of materials deposition capabilities, including electron-beam evaporation, sputtering, thermal evaporation, atomic layer deposition (ALD), and chemical vapor deposition (CVD). These systems support the deposition and growth of a diverse range of metals, dielectrics, semiconductors, and other functional materials. For materials removal and pattern transfer, the facility is equipped with multiple reactive ion etching (RIE) systems and an inductively coupled plasma (ICP) etching system, enabling both conventional and high-aspect-ratio dry etching processes. The cleanroom also provides a range of metrology and characterization tools, including atomic force microscopy (AFM), stylus profilometry, optical microscopy, and contact-angle measurements. Together, these capabilities provide researchers with an integrated environment for device fabrication, materials processing, and nanoscale characterization.

IMPORTANT
Prior to requesting training on specific instrumentation, all users must complete the Cleanroom Safety Training. Users should register for the required in-person training course through UTLearn. Completion of the safety training is required before users can receive instrument-specific training or access cleanroom equipment.