Dr. Jin Yang, an Assistant Professor, has recently been awarded a prestigious $25,000 pilot seed grant from the Semiconductor Research Corporation (SRC) to support cutting-edge research in semiconductor packaging.
This grant, designed to fuel the efforts of emerging principal investigators and foster industry collaborations, will support Dr. Yang's proposed project titled "Advancing Interfacial Fracture Analysis in Semiconductor Packages through Integrated DIC Methods and Cohesive Zone Modeling."
The focus of this innovative research is on enhancing the understanding of interfacial fracture behavior in semiconductor packaging. By developing advanced experimental techniques like Digital Image Correlation (DIC) and Digital Volume Correlation (DVC), Dr. Yang aims to characterize material properties in both 2D and 3D multilayered structures, which are crucial for the next generation of semiconductor technologies. These methods will provide high-fidelity data that will improve predictive modeling and the overall reliability of semiconductor packages.
By combining experimental measurements with cohesive zone modeling and simulations, the project is set to make significant advancements in both the characterization and prediction of interfacial fractures. Through the SRC seed grant, Dr. Yang's work aligns with the broader goal of supporting emerging technologies that could eventually lead to multi-year, industry-transforming collaborations. This project is a significant leap forward in ensuring the longevity and performance of semiconductor device!
